Fans have long been the go-to method for efficiently cooling electronic systems and power supplies due to their affordability and effectiveness in dissipating heat from electronic components. And although fans are a proven method, they also come with some drawbacks:
are common concerns when implementing fans into an application.
Many passive cooling systems like heatsinks or cooling baseplates have limitations and lose much of their effectiveness when used with higher power systems.
The result of our efforts is the new TCI power supply series, which utilizes an innovative hybrid case design, part encased and part encapsulated.
While the metal case ensures optimal heat transfer to any baseplate or case, the special potting compound does the same for the individual components by establishing an ideal thermal connection to all critical components which is otherwise hard to achieve within conventional power supply designs.
By combining the best aspects of both case types, the TCI series has superior thermal capabilities and can reach much higher power levels without the need of a fan within the same form factor compared to traditional power supply designs. When used in a conduction cooled setup the TCI series is able to deliver 80 to 100% of the rated maximum output power, making it an ideal solution for fanless application setups.
